米乐m6下载地址

地址:中国广东省惠州市惠阳区永湖镇鸿海精细化工基地。

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电镀米乐m6下载地址

高效镀铜光亮剂Cu-912

Efficient Copper Plating brightener Cu-912

特性及优点

Cu-912是一种直流电酸性镀铜光亮剂,它满足现今印刷电路板(PCB)分布状态、热循环、深镀能力TP%以及高纵横比通孔和微孔要求。Cu-912不仅具有高电流密度性能,而且表面分布状态和深镀能力均非同一般。与普通直流电镀光亮剂相比,Cu-912在电镀速度及镀层均匀性、镀层质量等方面有很大的改进,这不仅改善了性能,同时也提高了产量。

 

Features and Advantages

Cu-912 is a direct current acid coppering brightener. It satisfies the requirement of current PCB distribution status, thermal cycle, throwing power TP% and high aspect ratio through-hole and microhole. Cu-912 boasts not only high current density performance, but also extraordinary surface distribution status and throwing power. Compared with the ordinary direct current electroplating brightener, Cu-912 has great improvement in terms of electroplating speed, plating uniformity and quality, which not only enhances the performance, but boosts the output.

 

六大核心优势

Cu-912在电镀效率、上铜速率、镀铜均匀性、深镀能力、延展性和可靠性上的优势,能为您从容应对生产高难度PCB挑战时提供强有力的帮助。

 

Six Core Advantages

The advantages of Cu-912 in electroplating efficiency, copper velocity, copper plating uniformity, throwing power, extensibility and reliability can provide powerful help for you to calmly handle the challenge of producing high difficult PCB

 

特性分析

Cu-912镀铜凭借其良好的延展性、低热张力、低内应力等物理特性达到优秀抗热冲击特质,增加了镀通孔的可靠性,在焊接温度达到250°C以上的无铅装配焊接也表现得极为出色。

Cu-912已通过了一系列严格的OEM和特殊工业热冲击与热循环测试。

 

Feature Analysis

Cu-912 coppering boasts excellent thermal shock resistance by means of those physical characteristics as favorable extensibility, low thermal tension, and low internal stress, which strengthens PTH reliability. When soldering temperature reaches over 250℃,  it also has outstanding performance in lead free assembly soldering.

Cu-912 has passed a series of strict OEM, special industrial thermal shock and thermal cycling test.

 

通孔能力

Cu-912与其他同类型深镀能力对比图

镀铜添加剂决定镀通孔深镀性的高低,而深镀能力的高低对电镀品质有至关重要的影响。

Comparison Diagram of Cu-912 and Other Same Type in Throwing Power

Copper plating additive determines the height of plated-through-hole throwing power while throwing power height has crucial influence on electroplating quality.

 

(左图为:2.2mm厚PCB不同孔径深镀能力对比)

(Left Figure: 2.2mm thick  PCB, different aperture throwing power comparison)

 

 

 

超强的深镀能力将带来电镀工序多方面的提升。

Strong throwing power brings manifold improvements for electroplating procedure.

 

 

 

 

 

 

同时,Cu-912的高性能也能帮助在电镀成本控制方面做到极致。

Part in electropating cost control.


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